IEEE - Institute of Electrical and Electronics Engineers, Inc. - A reliability and failure mode analysis of no flow underfill materials for low cost flip chip assembly

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Smith, B.S. ; Thorpe, R. ; Baldwin, D.F.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 1,719 - 1,730
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853452
Regular:

Development of new material systems will increase flip chip market growth provided they reduce manufacturing time and enhance reliability. Among these new materials are no flow underfills.... View More

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