IEEE - Institute of Electrical and Electronics Engineers, Inc. - Improved bonding pad design for fluxless flip chip bonding process and low fracture strength substrates

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Bonda, R. ; Guo, Y. ; Stafford, J. ; Swan, G.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 1,701 - 1,704
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853449
Regular:

A fluxless flip-chip bonding process and a metallized glass substrate have been used for the development of an optical display module. Two major problems were encountered with this design and the... View More

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