IEEE - Institute of Electrical and Electronics Engineers, Inc. - Special characteristic of future flip chip underfill materials and the process

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Usui, H. ; Mizutani, M. ; Noro, H. ; Kuwamura, M. ; Kuroyanagi, A. ; Ito, H. ; Harada, T. ; Ito, S.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 1,661 - 1,665
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853442
Regular:

New materials and process for future flip chip packaging have been studied. Three types of new concept materials with suitable process are discussed in this paper. First is the preset underfill... View More

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