IEEE - Institute of Electrical and Electronics Engineers, Inc. - Warpage studies of HDI test vehicles during various thermal profiling

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Petriccione, G.J. ; Ume, I.C.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 1,640 - 1,646
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853438
Regular:

New techniques and technologies involved in the miniaturization of printed wiring board (PWB) fabrication are rapidly emerging. The quality, performance, and reliability of surface mount... View More

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