IEEE - Institute of Electrical and Electronics Engineers, Inc. - Evaluation of quality of silicon/copper interfaces in IC packaging

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Abdul, J. ; Wang, Y. ; Guo, N. ; Rehman, A. ; Chan, K.C.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 1,594 - 1,599
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853428
Regular:

The silicon die and copper lead-frame in IC packaging are bonded by die attach adhesive, and the quality of the interface is a critical issue in the reliability testing of IC packaging and during... View More

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