IEEE - Institute of Electrical and Electronics Engineers, Inc. - Characterization of low alpha emissivity system on electroplated solder bumps

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Mistry, A. ; Lee, S. ; Enman, C. ; Carroll, B. ; Mitchell, D. ; Mathew, V. ; Weeks, D. ; Tucker, M.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 1,587 - 1,593
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853427
Regular:

As attention to System Soft Error Rate (SSER) grows, better semiconductor design guidelines are being created. To protect sensitive transistor nodes from alpha particles emanating from trace... View More

Advertisement