IEEE - Institute of Electrical and Electronics Engineers, Inc. - Time-dependent material modeling for finite element analyses of flip chips

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Feustel, F. ; Wiese, S. ; Meusel, E.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 1,548 - 1,553
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853419
Regular:

Finite element analysis (FEA) has been established as an effective method for reliability assessment of flip chip assemblies. The simulation results are significantly dependent on the selected... View More

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