IEEE - Institute of Electrical and Electronics Engineers, Inc. - The effect of temperature cycling on fiber-solder-ferrule joints in laser module packaging

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Cheng, W.H. ; Sheen, M.T. ; Kuang, J.H. ; Chen, J.C. ; Wang, G.L. ; Wang, S.C. ; Chang, H.L. ; Wang, C. ; Wang, C.M.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 1,498 - 1,503
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853412
Regular:

The thermally-induced fiber alignment shifts of fiber-solder-ferrule (FSF) joints in laser module packaging have been studied experimentally and numerically. Direct measurements of the... View More

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