IEEE - Institute of Electrical and Electronics Engineers, Inc. - Alignment considerations in packaging array-based optical interconnects and processors

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Ghosh, A.K.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 1,493 - 1,497
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853411
Regular:

Because of micron-level size of optical components in arrays used in high-speed optical interconnection or switching systems, and the large number of elements in such arrays, achieving the... View More

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