IEEE - Institute of Electrical and Electronics Engineers, Inc. - Metallization for direct solder interconnection of power devices

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Haque, S. ; Guo-Quan Lu
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 1,475 - 1,482
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853407
Regular:

Inside the state-of-the-art power modules, interconnection of power devices is accomplished with wire bonds, which are prone to noise, parasitic oscillations, fatigue and eventual failure. The... View More

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