IEEE - Institute of Electrical and Electronics Engineers, Inc. - Development of Chip-on-Dot flip chip technique utilizing Gold Dot/sup TM/ flexible circuitry

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Wang, Z.P. ; Tan, Y.M. ; Schreiber, C.M. ; Tsui, C.C. ; Shi, Z.F. ; Wei, J.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 1,470 - 1,474
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853406
Regular:

A novel flip chip assembly technique, called Chip-on-Dot, has been developed for assembling chips which does not mandate either under-bump metallization (UBM) treatment to the aluminum... View More

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