IEEE - Institute of Electrical and Electronics Engineers, Inc. - Single level integrated packaging modules for high performance electronic systems

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Li-Rong Zheng ; Tenhunen, H.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 1,460 - 1,466
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853404
Regular:

In this paper, we introduce a novel packaging scenario that aims to integrate or eliminate the existing multilevel packaging hierarchies towards single level integration. The new approach is... View More

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