IEEE - Institute of Electrical and Electronics Engineers, Inc. - Chip scale polymer stud grid array packaging and reliability based on low cost flip chip processing

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Paydenkar, C.S. ; Baldwin, D.F. ; Sitaraman, S. ; Wong, C.P. ; Lewis, B.J.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 1,449 - 1,454
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853401
Regular:

The Polymer Stud Grid Array (PSGA) package is a new and unique type of area array chip package that shows significant advantages over conventional package configurations by virtue of its high... View More

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