IEEE - Institute of Electrical and Electronics Engineers, Inc. - Characterization of the melting and wetting of Sn-Ag-X solders

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Bradley, E., III ; Hramisavljevic, J.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 1,443 - 1,448
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853400
Regular:

There is tremendous interest presently with Pb-free solder assembly in the surface mount assembly industry in response to recent Japanese and European initiatives and proposed governmental... View More

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