IEEE - Institute of Electrical and Electronics Engineers, Inc. - Extensive fatigue investigation of solder joints in IGBT high power modules

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Thebaud, J.-M. ; Woirgard, E. ; Zardini, C. ; Sommer, K.-H.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 1,436 - 1,442
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853399
Regular:

IGBT (Insulated Gate Bipolar Transistor) power modules are more and more used in traction applications, where they replace thyristors and GTO (Gate Turn Off thyristors). Unlike the press-pack... View More

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