IEEE - Institute of Electrical and Electronics Engineers, Inc. - Lead free solder paste flux evaluation and implementation in personal communication devices

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Butterfield, A. ; Visintainer, V. ; Goudarzi, V.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 1,420 - 1,425
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853397
Regular:

This paper outlines the printing and wetting experimentation and the findings of a lead free solder paste comparison, and identifies one flux vehicle capable of performing across a wide... View More

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