IEEE - Institute of Electrical and Electronics Engineers, Inc. - New evaluation method of CSPs board level reliability using strain gauge

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Yamaji, Y. ; Suzuki, T. ; Yamasaki, H. ; Ohishi, T. ; Chikawa, Y. ; Kako, N.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 1,398 - 1,404
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853392
Regular:

The CSP is a package with external dimensions that have closely approached those of its chip in recent years. For this reason, it is increasingly being used in cellular phones. Unlike conventional... View More

Advertisement