IEEE - Institute of Electrical and Electronics Engineers, Inc. - Reliability characterization in Ultra CSP/sup TM/ package development

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Yang, H. ; Elenius, P. ; Barrett, S. ; Schneider, C. ; Leal, J. ; Moraca, R. ; Moody, R. ; Young-Do Kweon ; Deok Hoon Kim ; Patterson, D. ; Goodman, T.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 1,376 - 1,383
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853389
Regular:

Ultra CSP/sup TM/ is a wafer-level chip scale package developed by Flip Chip Technologies. This package provides a low cost packaging solution for various applications such as integrated passive,... View More

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