IEEE - Institute of Electrical and Electronics Engineers, Inc. - Vibration fatigue of /spl mu/BGA solder joint

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Tu, P.L. ; Chan, Y.C. ; Tang, C.W. ; Lai, J.K.L.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 1,369 - 1,375
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853388
Regular:

This paper studies the vibration fatigue failure of /spl mu/BGA solder-joints reflowed with different temperature profiles, and ageing at 120/spl deg/C for 1, 4, 9, 16, 25, 36 days. The effect of... View More

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