IEEE - Institute of Electrical and Electronics Engineers, Inc. - Numerical and experimental investigations of large IC flip chip attach

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Schubert, A. ; Dudek, R. ; Leutenbauer, R. ; Coskina, P. ; Becker, K.-F. ; Kloeser, J. ; Michel, B. ; Reichl, H. ; Baldwin, D. ; Qu, J. ; Sitaraman, S. ; Wong, C.P. ; Tummala, R.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 1,338 - 1,346
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853353
Regular:

Because flip chips can achieve high electrical interconnect speed, high density, and low profiles, a team from the Fraunhofer Institute for Reliability and Microintegration in Berlin and from... View More

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