IEEE - Institute of Electrical and Electronics Engineers, Inc. - Distance learning in thermal design of electronic systems - the IEEE/NSF project

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Joshi, Y. ; Sircar, J.K. ; Bar-Cohen, A. ; Bhavnani, S. ; Barnes, J.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 1,289 - 1,292
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853341
Regular:

A three-year collaborative effort initiated by three institutions has resulted in a new paradigm for distance learning in rapidly evolving technology areas, such as electronics packaging. From the... View More

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