IEEE - Institute of Electrical and Electronics Engineers, Inc. - System level packaging of high density optoelectronic interconnections

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Nyquist, J.S. ; Sherman, C.J. ; Grimes, G.J.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 1,272 - 1,277
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853337
Regular:

Large telecommunication switching and transmission platforms have massive interconnection requirements which have been doubling every 12-18 months. A discontinuity in interconnection requirements... View More

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