IEEE - Institute of Electrical and Electronics Engineers, Inc. - Reliability of flip chip BGA package on organic substrate

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Eun-Chul Ahn ; Tae-Je Cho ; Jong-Bo Shin ; Ho-Joong Moon ; Ju-Hyun Lyu ; Ki-Won Choi ; Sa-Yoon Kang ; Se-Yong Oh
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 1,215 - 1,220
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853328
Regular:

In this paper various reliability issues of the flip chip package on organic substrate, such as the 1st level bump joint reliability, die cracking, underfill cracking, and 2nd level solder ball... View More

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