IEEE - Institute of Electrical and Electronics Engineers, Inc. - Effect of package design and layout on BGA solder joint reliability of an organic C4 package

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Chandran, B. ; Goyal, D. ; Thomas, J.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 1,205 - 1,214
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853327
Regular:

Ball Grid Array (BGA) is currently the interconnect of choice for attaching microprocessors on a printed circuit board (PCB). The reliability of solder joints is one of the critical issues in BGA... View More

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