IEEE - Institute of Electrical and Electronics Engineers, Inc. - Assembly and solder joint reliability of plastic ball grid array with lead-free versus lead-tin interconnect

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Levis, K.-M. ; Mawer, A.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 1,198 - 1,204
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853326
Regular:

Many governments, particularly in Japan and Europe, have proposed laws reducing or eliminating the use of lead (Pb) and other toxic substances in products in an effort to decrease landfill... View More

Advertisement