IEEE - Institute of Electrical and Electronics Engineers, Inc. - New CBGA package with improved 2/sup nd/ level reliability

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Pendse, R. ; Afshari, B. ; Butel, N. ; Leibovitz, J. ; Hosoi, Y. ; Shimada, M. ; Maeda, K. ; Maeda, M. ; Yonekura, H.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 1,189 - 1,197
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853325
Regular:

In the present work, we have studied several improvements in the materials, structure and design of the conventional flip chip-on-ceramic single chip package aimed at increasing the 2/sup nd/... View More

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