IEEE - Institute of Electrical and Electronics Engineers, Inc. - Highly reliable probe card for wafer testing

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Maekawa, S. ; Takemoto, M. ; Kashiba, Y. ; Deguchi, Y. ; Miki, K. ; Nagata, T.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 1,152 - 1,156
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853317
Regular:

A probe card with tungsten probes (needles) is conventionally used for wafer testing. However, the electrical contact between a probe and an aluminum bonding pad becomes unstable, due to the... View More

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