IEEE - Institute of Electrical and Electronics Engineers, Inc. - Development of a wafer-level burn-in test socket for fine-pitch BGA interconnect

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Qiao, Q. ; Gordon, M.H. ; Schmidt, W.F. ; Li, L. ; Ang, S.S. ; Huang, B.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 1,147 - 1,151
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853316
Regular:

Contact beam structures for fine pitch (0.5-mm) test socket that will mate with 95/5 lead/tin solder balls (50/spl plusmn/5 /spl mu/m in diameter) were fabricated by conventional integrated... View More

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