IEEE - Institute of Electrical and Electronics Engineers, Inc. - Comparison of flip chip technologies on rigid polyimide with respect to reliability and manufacturing costs

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Miessner, R. ; Aschenbrenner, R. ; Reichi, H. ; Ling, S. ; Binh Le ; Lew, A. ; Benson, R. ; Nhan, E.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 1,133 - 1,138
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853314
Regular:

Flip chip interconnect technology has seen extensive growth with the demands for electronics miniaturization. Applying flip chip interconnection can potentially achieve smaller size, better... View More

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