IEEE - Institute of Electrical and Electronics Engineers, Inc. - The viability of anisotropic conductive film (ACF) as a flip chip interconnection technology

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Kim, K.M. ; Kim, J.O. ; Kim, S.G. ; Lee, K.H. ; Chen, A.S. ; Ahmad, N. ; Dugbartey, N. ; Karnezos, M. ; Tam, S. ; Kweon, Y.D. ; Pendse, R.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 1,122 - 1,132
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853312
Regular:

The use of anisotropic conductive film (ACF) to form the interconnection between the die and the substrate is one potential variation of flip chip technology. Its appeal comes with the ability to... View More

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