IEEE - Institute of Electrical and Electronics Engineers, Inc. - Bump height effect on the reliability and on the strains variations of ACA flip-chip joints

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Pinardi, K. ; Lai, Z. ; Yi Lan Kang ; Liu, J. ; Liu, S. ; Haug, R.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 1,118 - 1,121
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853311
Regular:

Flip-chip joining using anisotropically conductive adhesive (ACA) has become a very attractive technique for electronics packaging. Many factors can influence the reliability of the ACA flip-chip... View More

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