IEEE - Institute of Electrical and Electronics Engineers, Inc. - Eutectic Sn-Ag solder bump process for ULSI flip chip technology

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Ezawa, H. ; Miyata, M. ; Honma, S. ; Inoue, H. ; Tokuoka, T. ; Yoshioka, J. ; Tsujimura, M.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 1,095 - 1,100
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853307
Regular:

The novel developed Sn-Ag eutectic solder bump process provides several advantages over conventional solder bump process schemes. Steep wall bumps as plated were fabricated using the nega-type... View More

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