IEEE - Institute of Electrical and Electronics Engineers, Inc. - Interfacial adhesion study for low-k interconnects in flip-chip packages

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Miller, M.R. ; Ho, P.S.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 1,089 - 1,094
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853306
Regular:

This paper presents the results of a two-part study to determine the fracture toughness of relevant interfaces within Cu/Low-k interconnect structures and relate those data to the actual driving... View More

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