IEEE - Institute of Electrical and Electronics Engineers, Inc. - FEA simulation on moisture absorption in PBGA packages under various moisture pre-conditioning

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Lam Tim Fai
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 1,078 - 1,082
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853303
Regular:

FEA (Finite Element Analysis) simulation was carried out to study the moisture absorption behavior in plastic BGA packages under various moisture pre-conditioning. The modeling details are... View More

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