IEEE - Institute of Electrical and Electronics Engineers, Inc. - Over-coated flip-chip fine package development for MCM fabricated with Si IC and GaAs MMIC

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Kurata, H. ; Ogata, T. ; Mitsuka, K. ; Matsushita, H.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 949 - 954
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853281
Regular:

A newly developed over-coated Flip-chip Fine Package (ocFFP) and its assembly line are presented in this paper. OcFFP is a kind of chip scale package (CSP) and has several novel features that are... View More

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