IEEE - Institute of Electrical and Electronics Engineers, Inc. - Laser programmable multichip module using vertical make-link

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Joo-Han Lee ; Gao Zhuo ; Bernstein, J.B.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 932 - 936
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853277
Regular:

This paper presents a new design of laser-programmable substrate for multichip module (LPMCM) using a novel vertical make-link structure. The vertical make-link results from the cracked dielectric... View More

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