IEEE - Institute of Electrical and Electronics Engineers, Inc. - Electrical characteristics of an ACF bond as a function of temperature and humidity aging

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Weidler, J.D. ; Burg, R.D. ; Decker, J.J. ; Constable, J.H.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 906 - 913
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853273
Regular:

A commercial Hitachi anisotropic conducting film (ACF) was used to form the electrical interconnection between aluminum pads on a glass plate substrate, and electrolysis tin coated copper pads on... View More

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