IEEE - Institute of Electrical and Electronics Engineers, Inc. - Fabrication and adhesion of low stress electroless Ni-Cu-P bump on copper pad

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Chun-Jen Chen ; Kwang-Lung Lin
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 874 - 877
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853265
Regular:

The addition of copper into electroless Ni-P deposits will improve the thermal stability and the solderability of the deposits. However, it also results in excess tensile stresses of the deposits.... View More

Advertisement