IEEE - Institute of Electrical and Electronics Engineers, Inc. - Assessment on the effects of electroless nickel plating on the reliability of solder ball attachment to the bond pads of PBGA substrate

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Shi-Wei Ricky Lee ; Chien Chun Yan ; Karim, Z. ; Xingjia Huang
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 868 - 873
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853264
Regular:

This paper presents an experimental study to assess the reliability of solder ball attachment to the bond pads of PBGA substrate with various plating schemes. The basic structure of under bump... View More

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