IEEE - Institute of Electrical and Electronics Engineers, Inc. - A barrier metallization technique on copper substrates for soldering applications

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): So, W.W. ; Choe, S. ; Chuang, R. ; Lee, C.C.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 855 - 860
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853262
Regular:

In electronic products, copper has been widely used as substrates to mount semiconductor chips and electronic components using soft and ductile solders such as lead-tin alloys. The soft solder... View More

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