IEEE - Institute of Electrical and Electronics Engineers, Inc. - Investigation of high reliability micro bump plating technique on tape carrier

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Chinda, A. ; Matsuura, A. ; Yoshioka, O. ; Mita, M.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 850 - 854
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853261
Regular:

This paper describes the continuous copper bump plating technique for TAB tape carriers. We investigated the copper plating bath, pre-treatment agents and the bath agitation method. For high speed... View More

Advertisement