IEEE - Institute of Electrical and Electronics Engineers, Inc. - Under bump metallurgies for a wafer level CSP with eutectic Pb-Sn solder ball

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Soon-Jin Cho ; Ji-Yon Kim ; Myung-Geun Park ; Ik-Sung Park ; Heung-Sup Chun
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 844 - 849
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853260
Regular:

Six types of under bump metallurgies (UBM) were investigated in terms of ball shear strength, fracture surface analysis, the adhesion of sputter-deposited metal to dielectric polymer, and... View More

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