IEEE - Institute of Electrical and Electronics Engineers, Inc. - Chip scale package versus direct chip attach (CSP vs. DCA)

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Arnold, R.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 822 - 828
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853256
Regular:

When a systems designer is making choices related to what type of packaging is going to be used with the various integrated circuits used on the boards he now has the choice between Chip Scale... View More

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