IEEE - Institute of Electrical and Electronics Engineers, Inc. - Low cost packaging techniques for active waveguide devices

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Shaw, M. ; Marazzi, M. ; Bonino, S.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 742 - 748
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853242
Regular:

Recent developments in WDM systems have created an increased demand for low cost active waveguide devices (modulators, electro-optic switches etc). Standard packaging for these devices includes... View More

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