IEEE - Institute of Electrical and Electronics Engineers, Inc. - Gold-aluminum wirebond interface testing using laser-induced ultrasonic energy

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Romenesko, B.M. ; Charles, H.K., Jr. ; Cristion, J.A. ; Siu, B.K.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 706 - 710
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853236
Regular:

A new, non-destructive method of testing wirebonded interfaces is under development. The method uses thermoelastically-generated pulse of ultrasonic waves as a probe. This ultrasonic wave... View More

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