IEEE - Institute of Electrical and Electronics Engineers, Inc. - MEMS sensor multi-chip module assembly with TAB carrier pressure belt for aircraft flight testing

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Kim, N.P. ; Holland, M.J. ; Tanielian, M.H. ; Poff, R.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 689 - 696
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853233
Regular:

Many different sensor types and their associated electronic systems are utilized for aircraft and aerospace applications. When atmospheric data is collected like pressure load surveys for... View More

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