IEEE - Institute of Electrical and Electronics Engineers, Inc. - Challenges in interconnection and packaging of microelectromechanical systems (MEMS)

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Ramesham, R. ; Ghaffarian, R.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 666 - 675
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853230
Regular:

Integrated circuit packaging and their testing is well advanced because of the maturity of the IC industry, their wide applications, and availability of industrial infrastructure. This is not true... View More

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