IEEE - Institute of Electrical and Electronics Engineers, Inc. - Effect of circuit board flexure on flip chips before underfill

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Chengalva, M.K. ; Jeter, N. ; Baxter, S.C.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 657 - 665
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853229
Regular:

Manufacturing operations in high volume production induce flexure in circuit boards. Flip chip assemblies prior to underfilling are particularly vulnerable to stresses induced in the solder bumps... View More

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