IEEE - Institute of Electrical and Electronics Engineers, Inc. - Thermally induced deformations in a flip-chip HDI substrate

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Drexler, E.S.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 650 - 656
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853228
Regular:

At issue was the thermomechanical response of microvias in a high-density interconnect (HDI) substrate. The HDI package containing microvias, blind vias, solder bumps, and line traces was... View More

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