IEEE - Institute of Electrical and Electronics Engineers, Inc. - Prediction of fatigue crack initiation between underfill epoxy and substrate

2000 Proceedings. 50th Electronic Components and Technology Conference

Author(s): Wu, D. ; Su, B. ; Lee, Y.C. ; Dunn, M.L.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2000
Conference Location: Las Vegas, NV, USA, USA
Conference Date: 21 May 2000
Page(s): 646 - 649
ISBN (Paper): 0-7803-5908-9
DOI: 10.1109/ECTC.2000.853227
Regular:

Delamination between underfill epoxy and a substrate is a critical reliability concern for flip-chip assemblies. Delamination often initiates from multimaterial interface corners, which are sites... View More

Advertisement